大瑞科技股份有限公司

大瑞科技秉持技術創新精神,提供半導體、LED及太陽能產業高品質低成本之產品及服務。走過蓽路藍縷的草創階段,大瑞科技已經是全球BGA、CSP等高端IC封裝用錫球之領導廠商,終端應用產品包括CPU、繪圖晶片、DDR甚至手持行動裝置所需晶片。

2010年大瑞科技透過購併、組織擴編成立IC、LED及太陽能晶片封裝用之銲線材料事業部,不僅在高單價位金線外提供客戶低成本之替代性材料-銀線及銅線,也讓大瑞科技在原有高階IC封裝材料領域外跨入LED及太陽能等深具未來成長潛力的產業。

大瑞科技以一貫誠正信實之理念,提供全方位解決方案之服務精神,正逐步擴大封裝材料之市場版圖。

Profound Material Technology Co., Ltd. (PMTC) upholds the spirit of technological innovation and offers its services to Semiconductor, LED and Solar Energy Industry with high quality and low cost products. After go through the initial stage of production, PMTC has become one of the world’s largest solder balls supplier for BGA, CSP and other high-end IC packaging. Its application is the chips required in CPU, GPU, DDR and even hand-held mobile device.

In Year 2010, through the acquisition, Profound Material Technology Co., Ltd. expands and organizes a new material division – alloy wire, which used in chip packaging of IC, LED and Solar Energy Industry. We provide an alternative low cost materials, silver wires and copper wires to replace the high cost material (gold wire). Thus, besides current high-end IC industry, Profound Material Technology Co. Ltd. has also get into the packaging materials territory in LED and Solar Energy, the future potential industry.

With the philosophy of "honest is faithful"; and providing a comprehensive solutions service to customer, PMTC being gradually expanded its territory of packaging materials market.